Intel NUC Skull Canyon Intel NUC Kit NUC6i7KYK 3 kom

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Product Collection
Intel® NUC Kit with 6th Generation Intel® Core™ Processors
Code Name
Products formerly Skull Canyon
Processor Included
Intel® Core™ i7-6770HQ Processor (6M Cache, up to 3.50 GHz)
Board Number
NUC6i7KYB
Supported Operating Systems
Windows 10, 64-bit*, Windows 8.1, 64-bit*, Windows 7, 64-bit*, Windows Server 2012 R2*, Windows Server 2012*
Supplemental Information
Marketing Status
Discontinued
Launch Date
Q2'16
Warranty Period
3 yrs
Embedded Options Available
No
Description
Other features: Includes Thunderbolt 3 (40Gbps) USB 3.1 Gen 2 (10Gbps) and DP 1.2 via USB-C; also includes SDXC card slot
CPU Specifications
Total Cores
4
Total Threads
8
Max Turbo Frequency
3.50 GHz
Processor Base Frequency
2.60 GHz
Memory & Storage
Max Memory Size (dependent on memory type)
32 GB
# of Memory Slots
2
Memory Types
DDR4-2133+ 1.2V, 1.35V SO-DIMM
Max # of Memory Channels
2
Max Memory Bandwidth
34.1 GB/s
ECC Memory Supported ‡
No
Internal Drive Form Factor
M.2 SSD
# of Internal Drives Supported
2
Removable Memory Card Slot
SDXC with UHS-I support
M.2 Card Slot (storage)
2x 22x42/80
I/O Specifications
Graphics Output
Mini-DP 1.2; HDMI 2.0; USB-C (DP1.2)
# of Displays Supported ‡
3
# of Thunderbolt™ Ports
1x Thunderbolt™ 3
# of USB Ports
9
USB Configuration
2x front and 2x rear USB 3.0, 1x USB 3.1 via Thunderbolt 3; 2x USB 2.0, 2x USB 3.0 via headers
USB Revision
2.0, 3.0, 3.1 Gen2
USB 2.0 Configuration (External + Internal)
0 + 2
USB 3.0 Configuration (External + Internal)
2F, 2R, 2i
Total # of SATA Ports
2
Max # of SATA 6.0 Gb/s Ports
2
RAID Configuration
(2x M.2 SATA or 2x M.2 PCIe) SSD (RAID-0 RAID-1)
Audio (back channel + front channel)
7.1 digital; L+R+mic (F); L+R+TOSLINK (R)
S/PDIF Out Connector
TOSLINK
Integrated LAN
Intel® Ethernet Connection I219-LM
Wireless Included
Intel® Dual Band Wireless-AC 8260
Bluetooth Version
4.2
Consumer Infrared Rx Sensor
Yes
Additional Headers
CEC, 2x USB2.0, 2x USB 3.0, FRONT_PANEL
Expansion Options
PCI Express Revision
Gen3
PCI Express Configurations ‡
Dual M.2 slots with PCIe x4 lanes
Package Specifications
TDP
45 W
DC Input Voltage Supported
19 VDC
Chassis Dimensions
211 x 116 x 28 mm
Board Form Factor
UCFF (4" x 5")
Advanced Technologies
Intel® HD Audio Technology
Yes
Intel® Rapid Storage Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® Virtualization Technology (VT-x) ‡
Yes
Security & Reliability
Intel® Platform Trust Technology (Intel® PTT)
Yes
TPM
No
Intel® AES New Instructions
Yes

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatso